HBX PLUS
HBX PLUS is ideal for applications that call for long length and low loop bonds. Williams' alloying expertise and stringent manufacturing process controls provides the foundation to meet the industries need for high-speed fine pitch bonding wire.
Engineered Chemistry & Superior Technology (put the following in bullets format)
- Specifically designed chemistry for high speed, fine pitch wire bonding
- Precise control of impurity levels leads to consistent material properties.
- Be and Ca modified, 4-9's Au wire for improved break strength and smaller heat affected zones
- Fully automated, multiple pass drawing technology leads to consistent wire properties, better wire finishes and improved bonding quality
- Capable of winding up to 2000 meters per spool for improved equipment up time
By controlling the dopant levels, the annealed break strength of the wire is increased, making HBXPLUS ideal for long length bonds.
The same dopants also act to raise the re-crystallization temperature, which minimizes the HAZ, making HBX PLUS ideal for forming low loops.
Performance Attributes (put the following as bullets)
- Ideal for long length, low loop bonds
- Very resilient, high stiffness resistant to wire sweep
- Improved bonding tool performance
Process Example
| Wire Diameter |
.001" |
| Wire Span |
150 to 170 mils |
| Loop Height |
.006" |
| Machine Type |
K&S 8020 |
| Package Type |
QFP 160 Lead |
|
