Ultra-low gas entrapments that ensure defect-free devices.
EVAPro™
Process
Williams Advanced Materials' evaporation products have reached a higher level of performance! Our
EVAPro™ process technology produces higher yields when evaporated onto compound semiconductor wafers, minimizing defects caused by splattering. EVAPro™ evaporation materials contain ultralow
gas entrapments that ensure defect-free devices.
BENEFITS
- Minimal defect count from start to finish
- Ideal Alloy Homogeneity
- Stable evaporation process parameters
- Optimal precious metal usage per run
MATERIALS & FORMS
Purity Levels up to 99.999%
Materials |
Slugs Starter Sources |
Wire Clips |
Ag |
X |
X |
Ag As |
X |
X |
Ag Cu |
X |
X |
Ag Ga |
X |
X |
Ag Pd |
X |
X |
Al |
X |
X |
Au |
X |
X |
Au Ag Pt |
X |
X |
Au As |
X |
X |
Au Ge |
X |
|
Au Ni |
X |
X |
Au P |
|
X |
Au Sb |
X |
X |
Au Si |
X |
|
Au Sn |
X |
|
Au Zn |
X |
X |
Cr |
X |
|
Ni |
X |
X |
Pd |
X |
X |
Pd Ag |
X |
X |
Pd Mn |
X |
X |
PT |
X |
X |
Ti |
X |
|
Additional material is available. |
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Have a question? |
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