Complete CPV Material offering; thin film materials, bonding ribbon, solder preforms, and BeO submounts.
Williams Advanced Materials offers a wide variety of products for the fabrication and packaging of Concentrator Photovoltaics (CPV). The heart of CPV is the multi-junction (MJ) chip, which is typically comprised of three or more compound semiconductor epi layers grown on a germanium substrate. Leading-edge MJ diodes exhibit world-record photovoltaic efficiency, viz., over 40%. The backside of the chip is then attached to a ceramic substrate, with wire or ribbons used to contact the topside electrical contact. This CPV submount must withstand severe temperature cycling and thermal flux of 100 – 2000 suns (depending on the optics) over 30 years. The experienced sales engineers at Williams can recommend the optimal material solutions for these demanding conditions, while staying in your budget.
Thin Film PVD Materials & Services
Multijunction chips are one example of devices manufactured by compound semiconductor industry. Williams has 20+ years experience supporting the compound semiconductor industry with a wide range of materials and services:
Sputtering targets:
Evaporation Slugs:
Services:
- Shield kit cleaning
- Precious metal reclaim
Microelectronic Packaging Products
Bonding Ribbon:
Solders:
Metallized BeO Substrates
- Optimal material for receiver submounts
- Superior thermal conductivity
- High dielectric strength
- Excellent thermal expansion match to Ge
Thin Film Services
Our Thin Film Technology division can provide a variety services to the CPV industry, including:
- Thin film metallization services
- Lithographic patterning
- Anti-reflective coatings applied to the surface of the multijunction chip
- Anti-reflective coatings for glass used on the receiver
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