Hybrid Micro Electronics

Williams is a leading thin film materials supplier to the Hybrid/Micro electronics industry. Fine grain alloys of Aluminum, Nickel, and W/Ti exceed industry requirements for sub-micron circuitry design. Passive devices and hybrid circuitry manufacturers are well served with high quality PVD materials. Specialty products such as our EVAPro™ evaporation materials, SFG™ and our VCT™ technology highlight the fact that WAM TFP is a leader in developing engineered solutions for our customers.

Material offering for the
Hybrid Micro Electronics Market

Additional materials are available.

Williams produces a vast array of pure materials, alloys, ceramics, and cermets to meet the thin film requirements of the hybrid micro electronic industry. Through our fully integrated manufacturing facilities, we have the capability of offering materials processed via vacuum casting or powder metallurgy techniques. Custom designed backing plates for both DC or RF processing, complete target bonding services, and precious metal recycling programs round out our product offering.

PVD materials produced serve the passive device and hybrid circuitry sectors of the industry. Careful attention is paid to alkaline impurities, which could cause electromigration resulting in device failure. Cost of ownership solutions such as SFG™, ME™ grades, and X-Tended Life sputtering targets have been developed to help our customers increase target lifetime and stabilize process conditions. All targets and evaporation materials are fully analyzed in our lab prior to shipment.

By maintaining a fully integrated facility, Williams is able to provide industry leading lead times and cycle times on a worldwide basis. We maintain a full staff of metallurgists and applications engineers at our manufacturing facilities, as well as support personnel in key locations around the globe.

Cost of ownership solutions such as SFG™, ME™ grades, and X-Tended Life sputtering targets have been developed to help our customers increase target lifetime and stabilize process conditions.