MEM's

MEMS, or Micro-Electro-Mechanical Systems, are expanding into new product niches at a steady pace, and already are considered mature technology for applications such as accelerometers (the largest current application), gyroscopes, temperature sensors, chemical sensors, AFM probes, micro-lenses, comb drive actuators and piezoelectric actuators. Enormous R&D resources are being utilized to drive the next generation devices that will continue to have a large impact on many sensor and consumer applications in the decades to come, particularly in the RF domain for wireless applications.

Williams Products Used

Williams products are critical to the manufacturing of MEMS bases products for both optical and mechanical devices. Products offered range from precious metals for reflective, stress control and contact alloys to non-precious materials for contacts, adhesion layers and stress control.

The thin film product line supports MEMS fabrication with both EVAPro™ evaporation slugs, and sputtering targets with SFG™ technology. A full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services and assuring timely turnarounds.

Our packaging product line supports MEMS fabrication with solder preforms, bonding wire and ribbon along with a variety of hermetic lids. Williams has a library of over 8,000 tools, and a complete in-house tool and die shop to support your solder preform needs. Hermetic lid options for MEM Devices include: the traditional Combo-Lid®, the Micro-Lid® for packages smaller than .300 square and the Visi-Lid® for optical packages requiring a window.

Williams also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services and assuring timely turnarounds.

What are MEMS Devices?

MEMS are micro devices that are fabricated using traditional microfabrication techniques such as thin film deposition, lithography and etching. Traditionally the base material has been silicon, but more recently MEMS have been fabricated on compound semiconductors such as GaAs and SiGe.