Delivering value-electronic packaging products, thin film materials, metal recovery and chamber services
Since the photonics and optoelectronics market exploded in the last several years, Williams has been involved in many aspects of the industry, working closely with several R&D facilities and equipment manufactures, giving us vast experience in photonic applications. Today, Williams is strategically aligned to offer a total solutions approach, including thin film materials, packaging materials and refining services for all precious metal photonics applications ranging from LEDs to WDM to photodiodes.
Williams Advanced Materials provides a complete array of thin film materials for compound semiconductors used in photonics devices. Thermal (resistive) and E- beam evaporation processes are enhanced with our EVAPro™ material. EVAPro™ is a proprietary technology of Williams Advanced Materials, that causes ultra-low internal gas entrapments and ensures the lowest defect count per wafer from the initial soaking time to the last evaporation run.
Sputtering materials are produced in a wide array of shapes and sizes meeting the requirements of virtually any sputtering tool design. Williams has developed SFG™, a process to produce sputtering targets with optimal grain size of 100 microns or less. For brittle material such as Au/Ge and Au/Sn, our VCT™ casting technology ensures small-randomly oriented grain and 100% alloy homogeneity at the time it is cast. SFG™ ensures greater thin film yields (uniformity) and maximizes target utilization.
Williams also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. With target bonding facilities throughout the world, industry leading bonding services and minimized shipping logistics are assured.
Material offering for the Photonics Market
Tantalum | Silicon Dioxide |
Niobium | Indium Tin Oxide |
Aluminum | Zinc Oxide |
Chromium | Copper |
Titanium | Hafnium |
Silicon | Zirconium |
Zinc | Vanadium |
Gold | Gold Germanium |
Silver | |
Additional materials are available.
In addition to providing evaporative and sputtering materials for thin film applications, Williams also supports the assembly of photonic/packages with a variety of hermetic lids, gold tin and indium preforms, as well as bonding wire and ribbon.
Our in-house precious metal refining and recycling program includes: spent targets, chamber scrapings, coated shield kit and parts cleaning. The utilization of this program results in lower cost and minimized precious metal inventory.
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