SAW Devices

Since Surface Acoustical Wave (SAW) technological development began at Bell Telephone Labs in 1965, SAW devices have transformed from R&D Defense projects to intrinsic components in applications such as cellular phones, pagers, ID tags, cellular base-stations, local area networks, and high definition TV (HDTV).

Williams Products Used

Williams participates in the SAW device manufacturing in several different areas. Williams offers a full range of hermetic SAW packaging solutions including Seam Seal Lids, AuSn and AuGe preforms and our proprietary Microlid™. Williams also offers Au bonding wire and Au targets featuring SFG™ technology and Au EVAPro™ evaporation slugs for contact metallization and attachment.

Williams also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services and assuring minimized shipping logistics.

What are SAW Devices?

As the frequency of RF devices decrease, the devices themselves must increase in size. Below a certain frequency, standard RF devices become prohibitively large. If the RF signal is first converted into acoustic waves, the components that are required to filter or modify these waves are much smaller. After filtering or modification the acoustic waves can then be reconverted into RF signals, minimizing the overall device size.