Williams supports all OEM configurations
As the leading supplier of thin film deposition materials for the Compound Semiconductor industry, Williams has now focused efforts of becoming the preferred supplier for thin film deposition materials for UBM and Traditional semiconductor manufacturers. Recognizing the need for a supplier with leading edge material technology combined with a low manufacturing cost base and global logistics, Williams has developed comprehensive thin film and semiconductor packaging product offerings focused on providing superior cost of ownership advantages.
Williams has focused our global production, sales and technical staff to focus on both Front Side and Back Side wafer applications.
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Front Side
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Back Side
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Traditional Silicon Wafers
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Under Bump Metallurgy (UBM) Stacks
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Advanced Compound Semiconductor Wafers
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Williams thin film materials technology is backed by superior technical support that is available to aid customers trouble shooting a problem or developing new processes. Customers are encouraged to use our technical support network consisting of:
- Applications Support (Including in-house fab support)
- Metallurgical Support
- Process Engineering Support
The manufacture of today's semiconductor devices requires consistent and controlled products made to the highest quality standards. Using state of the art production techniques, Williams controls all critical manufacturing variables to thin film deposition materials so products are manufactured to the highest quality standards attainable, always meeting or exceeding customer or OEM requirements.
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