WAM guarantees the lowest "cost of ownership" savings to semiconductor device manufacturing
Applications Supported
As a proven leader in semiconductor sputtering target technology, Williams offers a comprehensive range of thin film deposition materials for all major semiconductor applications including:
Application | Material Set |
Interconnect | Aluminum, Aluminum Alloys, Copper |
Barrier | Titanium, Tantalum, TiW, Ruthenium, Ruthenium Alloys |
Gate | Platinum Titanium, Cobalt, Nickel, Nickel Alloys |
Backside | Metallization Silver, NiV, TiW |
Other Materials | Gold, Tungsten, NiFe, SiCr, R&D Materials |
With our extensive metallurgical knowledge, Williams also has the ability to tailor alloys to customer specific requirements.
Williams supports all major OEM platforms for 200mm and smaller wafer requirements. OEM platforms supported include:
- Applied Materials™
- Novellus™ (Varian™ )
- Unaxis™ (Balzers™ )
- Trikon™
- KDF™ (MRC™ )
- Metron™ (MRC™ )
- SFI™
- Ulvac™
Williams also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services while minimizing shipping logistics.
Material Quality Assurance
Understanding that the quality of the deposited films is heavily dependent upon the quality of the semiconductor sputtering target, Williams carefully designs our process and subsequently controls critical variables that have an impact on:
- Dimensional Tolerances
- Composition (Alloys)
- Impurities
- Grain Structure
- Crystal Orientation
- Magnetic Permeability (for magnetic materials)
- Bond Integrity
Williams maintains a full engineering and quality staff that work together to provide quality products. As an ISO9001:2000 supplier dedicated to continuous improvement, Williams will provide products that meet or exceed customer specifications and OEM requirements.
Cost of Ownership Solutions
To provide superior cost of ownership advantages to our customers, Williams dedicates efforts to ensure and enhance the following core principles to our product manufacture:
- Economies of Scope
- Automation
- Lean Manufacturing and Continuous Improvement
- Improved Sputtering Target Technology
- Strategic Supplier Agreements
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