One stop shop for electronic packaging products and thin film materials
Williams has witnessed firsthand the dramatic growth in technology and applications for wireless devices. Through strategic partnerships with many industry leaders, Williams remains at the forefront of both technical advances and shortcomings, and works in partnership to develop solutions. As higher power and higher frequencies are demanded from wireless devices, the semiconductor substrates must often be changed to larger bandgap semiconductors such as SiC and GaN. Williams has remained on the leading edge of these technologies and offers a complete array of material solutions, ranging from the metallization of semiconductors and crystal oscillators to the hermetic packaging of SAW devices.
Williams provides a complete array of thin film materials for use in wireless applications. Thermal (resistive) and E- beam evaporation processes are enhanced with our EVAPro™ material. EVAPro™ is Williams' proprietary technology that causes ultra-low internal gas entrapments and ensures the lowest defect count per wafer from the initial soaking time to the last evaporation run.
Sputtering materials are produced in a wide array of shapes and sizes to meet the requirements of virtually any sputtering tool design. Williams has developed SFG™, a process to produce sputtering targets with optimal grain size of 100 microns or less. For brittle material such as Au/Ge, Au/Sn, and Au/Zn, our VCT™ casting technology ensures small-randomly orientated grain and 100% alloy homogeneity at the time it is cast. SFG™ ensures greater thin film yields (uniformity) and maximizes target utilization.
Williams also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services and assuring minimized shipping logistics.
In addition to providing evaporative and sputtering materials for thin film applications, Williams also supports assembly/packaging with a variety of hermetic lids, gold tin and indium preforms, as well as bonding wire and ribbon.
Our in-house precious metal refining and recycling program includes: spent targets, chamber scrapings, coated shield kit and parts cleaning. The utilization of this program results in lower cost and minimizes precious metal inventory.
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