Proprietary process delivers cleaner and more uniform wire than traditional methods.
Williams Advanced Materials bonding wire and ribbon is manufactured using a proprietary hydrostatic extrusion process, providing a cleaner and more uniform wire. The extrusion process eliminates imperfections due the extreme pressure that envelops the metal as it passes through the die; therefore, fewer reductions are necessary. The end product produces smaller, more uniform ball size on the bonding pad and reduces bonding tool problems.
Gold Bonding Ribbon is designed for high-power, high-reliability applications such as microwave devices. Williams' extrusion process is well suited to achieve the metallurgical consistency and winding requirements of all bonding ribbon applications.
Typical Mechanical Properties for Gold Bonding Wire and Ribbon
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