Williams - the micro electronics industry's cover lid innovator.
Williams Advanced Materials manufactures a variety of hermetic lids for the semiconductor, hybrid/micro electronics and optical markets. In the early 1980’s Williams began tack welding its own frames and lid components together for what has become the traditional Combo-Lid®. Throughout the years Williams has partnered with various companies to develop new hermetic lid styles to meet the changes in packaging designs and sizes.
The Williams hermetic lid product line includes: Micro Lids™ for packages smaller than .300 square, Seam Seal-Lids™ for sealing heat sensitive electronics, Solder Reflow-Lids™ , a cost alternative to the Combo-Lid® and our newest lid, the Visi-Lid™ for optical packages.
Williams is the leading Combo-Lids® manufacturer in the world with operations in North America, Singapore and the Philippines in support of this product line. |
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