Solder Reflow Lid™ - A hermetic lid with non-precious solder.
The Solder Reflow Lid™ is a cost effective alternative to a Combo-Lid® for smaller lids, typically less than 0.2" by 0.2". Solder Reflow Lids are available with non-precious solders, eliminating any of the precious metals in the package. The traditional Combo-Lid is manufactured by tack welding a gold tin solder preform to a plated Kovar lid. The Solder Reflow Lid is manufactured in an atmosphere controlled furnace by melting a non precious solder onto the surface of a plated strip. The strip is then stamped into parts that meet the customer’s dimensional specifications.
Technical Information
Layer |
CTE
(µin/in/oC) |
Layer
Thickness |
Kovar |
4.9 |
Balance |
Ni |
13.3 |
50-350 µin |
(Solder Layer - See recommendations below) |
Sizes
Williams can provide numerous sizes to fit your needs. We have a large library of available tools. For cost effectiveness the Solder Reflow Lid is typically used for packages with dimensions of .200” X .200” or smaller.
Typical Lid Tolerances
X-Y dimensions: ± 0.003"
Thickness: ± 0.0003"
Flatness: within 0.001"
Solder Attributes and Material Recommendations
With solder coverage controlled right up to the lid edge, Williams' Solder Reflow-Lid™ easily passes gross leak tests and has set the benchmark within the industry.
Solder Reflow Lids with 86Pb8Bi4Sn1Ag1In have a melting range of 250°-278° F. Therefore a furnace profile similar to 80Au 20Sn (Eutectic 280) can be used. For situations calling for a lead free solder 95.Sn 3.5Ag 1.9Sb which as a melting range of 218°-226° F is viable solution. Customized solders are available to meet your requirements.
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