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Material Shelf Life Commitments

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The table below provides the standard shelf life of common product/alloy combinations when stored under the following conditions:

  1. (a) Material packages backfilled with nitrogen or argon at Williams Advanced Materials remain sealed (or) containers opened upon receipt at customer facilities are stored in a dry nitrogen or argon storage cabinets maintained between 65° F and 85° F. Material packages packed without nitrogen or argon at Williams Advanced Materials remain sealed (or) containers opened upon receipt at customer facilities are stored in a temperature and humidity controlled room or in dry nitrogen or argon storage cabinets. When opened packages are stored in a room, the room temperature must be maintained between 65° F and 85° F and the relative humidity in the room must be maintained between 30 and 70 percent to ensure shelf life, and;

  2. (b) Materials produced by Williams Advanced Materials should be used in a first-in-first-out basis on the basis of the date of manufacture, as stated on the product label applied by Williams Advanced Materials.

Material or Product

Form

Shelf Life 1

Gold-Tin (AuSn) alloys.

Solders, preforms, ribbon, frames, and physical vapor deposition materials

12 Months from date of manufacture

Gold-Germanium (AuGe), Gold-Silicon (AuSi), Gold-Beryllium ( AuBe), and Gold-Arsenic (AuAs) alloys; also Silver (Ag) alloys.

Solders, preforms, ribbon, frames, and physical vapor deposition materials

6 Months from date of manufacture

Lead (Pb) alloys.

Solders, preforms, ribbon, frames, wire, and physical vapor deposition materials

3 Months from date of manufacture

Gold (Au), Platinum (Pt), Palladium (Pd), and alloys thereof.

Solders, preforms, ribbon, frames, wire, and physical vapor deposition materials

12 Months from date of manufacture

Clad materials with both exposed sides comprised of a Gold (Au) based alloy where gold is the predominant percentage of the exposed alloy(s)

Preforms and ribbon

6 Months from date of manufacture

Clad materials with one or both exposed sides comprised of a Silver (Ag) or Lead (Pb) based alloy where silver or lead are the predominant percentage of the exposed alloy

Preforms and ribbon

3 Months from date of manufacture

Clad materials with one or both exposed sides comprised of an Aluminum (Al) based alloy

Preforms and ribbon

6 Months from date of manufacture

Copper (Cu)

Preforms and ribbon

6 Months from date of manufacture

Silver (Ag) and Silver (Ag) alloys

Preforms, ribbon, and physical vapor deposition materials

6 Months from date of manufacture

Gold based Electronic Packaging Materials

Frame Lid Assemblies, Gold Plated Lids, and Gold-Tin Frames

12 Months from date of manufacture

Non-Precious based Evaporation and Sputtering Materials (PVD Materials)

Targets, Evaporation Pellets, Evaporation Clips, Evaporation Wire

6 Months from date of manufacture

Non-precious Materials (“Structural Metals”)

Ribbon and Rod

Indeterminate

Gold and Platinum based fine bonding wire/ribbon

Fine Wire and Ribbon

12 Months (2) from date of manufacture

Aluminum and Copper based fine bonding wire/ribbon

Fine Wire and Ribbon

6 Months (2) from date of manufacture

Notes:

1 - Some materials shipped may be recertified in terms of shelf life through functional testing at Williams Advanced Materials. If recertification is required, contact your Williams Advanced Materials sales representative to discuss recertification fees and where to send samples for recertification purposes. The shelf life can be extended on certain materials through rework such as: etching, abrading, or annealing in a reducing atmosphere.

2 - To attain maximum shelf life, fine wire must be stored in a nitrogen or argon dry box and must be positioned as shown to prevent shifting of the wire (which can result in despooling problems through tangling and overlap).