Thin Film Standard Tolerances

The following represent typical manufacturing capabilities and tolerances for Williams Thin Films product line. Standard manufacturing capabilities and tolerances may vary slightly from one manufacturing location to another, based on material characteristics, product configuration and equipment availability. All items will be inspected to the tolerances listed below unless further tolerances have been agreed to during the quotation process or prior to order placement.

DIMENSIONAL:

"Hot Pressed" Targets
Thickness:	± 10% total thickness
	(± .015" minimum) (±.381 mm)
Length, Width, Diameter:	</= 3"(76.2mm): ±.020" (± .508mm)
	> 3"(76.2mm): ±.050" (±1.270mm)
Flatness:	</= 8"(203.2mm): within .012" (.3048mm)
	> 8"(203.2mm): within .0015"/in (.0381mm) per inch
Density:	+x/-10% of specification
All Other Targets (Including Hip'ed Material)
Thickness:	±.015" (±.381 mm)
Length, Width, Diameter:	+.020/-.000" (+.508/-0 mm)
Flatness:	</= 8"(203.2mm): within .012" (.3048mm)
	> 8"(203.2mm): within .0015"(.0381mm) per inch
	</= 0.125" (3.175mm)Thick and >/= 8" (203.2mm): best efforts
Drilled Holes (diam. & location):	±.010" (±.254mm)
Inside Diameters:	Fractions +/- 1/32
	Decimals .xx +/- .015 (±.381mm), .xxx +/- .005 (±.127mm)
Machined "Backing Plates"
Thickness:	±.015" (±.381mm)
Length, Width, Diameter:	+.000/-.020" (+0/-.508mm)
Flatness:	</= 8"(203.2mm): within .012" (.3048mm)
	> 8"(203.2mm): within .0015"(.0381mm) per inch
Drilled Holes, Diam & Location:	±.010" (±.254mm)
Inside Diameters:	Fractions +/- 1/32
	Decimals .xx +/- .015 (±.381mm), .xxx +/- .005 (±.127mm)
Angles
Unless otherwise stated:	± 1 degree
Foils (all metals .031" thick)
Thickness:	± 20% total thickness
Length, Width, Diameter:	± .063"
Flatness:	No tolerance
"Wire"
Diameter:	± 20% (±.005"min)
"Random pcs" for evaporation
All dimensions:	within .1" - .5"
"Saw Cut" edges
Length, Width, Diameter:	± .125"
"As Rolled" finish
Flatness:	No tolerance
"Crucible Liners*"
Major O.D.:	+.000/-.025"
Height:	+.125"/-.050"
Angles:	±1 degree
Wall Thickness:	±50%
	(±.031" maximum)
Inside & Outside Radii:	no tolerance
"Starter Charges"
Major O.D.:	+.000/-.010”
Minor O.D.:	Reference Only
Height:	±.050"
Angles:	0

*Note: Crucible liner tolerances apply only to those sold by actual dimensions stated on the sales contract. 7cc, 15cc and 25cc crucible liners ordered without dimensions or tolerances are guaranteed to fit Temescal and Telemark evaporators.

WEIGHT:

Note that all materials sold by weight do not have dimensional standard tolerances. All sizes are approximate.
5.1 Standard Powders:	±2% total weight
5.2 Evaporation Materials: (shot, slugs, flakes, random pieces)	±1% total weight
	or ±1 unit
5.3 Precious Metals: Au, Ir, Os, Pd, Pt, Ru, Re and Rh.	priced by actual weight to 0.1 gram

COMPOSITIONAL

Weight % Solute	Tolerance
<5	Best Efforts
5	± .5%

 PURITY

Sold as Purity (%)	Maximum ppm
	99
99.5	5,000
99.8	2,000
99.9	1,000
99.95	500
99.97	300
99.98	200
99.99	100
99.995	50
99.998	20
99.999	10
99.9995	5
99.9999	1
All Materials with Typical Analyses	Not guaranteed

Notes:

1) All materials whose ppm levels fall within an unspecified range will be rated at the next lowest purity (e.g. 1750 ppm = 99.8).

2) Any material sold at a purity not listed above will have less than the maximum ppm value for that purity (e.g. 99.7 = <3000 ppm).

BONDING

 Note: For all bonded targets, the bond side is not regulated by visual tolerances listed in "VISUAL" below. For metallically bonded targets, the sputter side is not regulated by flatness tolerances listed in "DIMENSIONAL" above; whereas, for epoxy bonded targets, the bond side is not regulated by flatness tolerances listed in "DIMENSIONAL" above.

8.1 Solder Protrusions:	None allowed
8.2 Solder Voids (Ceramic Targets):	< 3/16" inward
8.2.1 Solder Voids (Metal Targets):	No Visual Voids
8.3 Bond Centering:	within .020"
8.4 Flatness of Bonded Assemblies' Mounting Surfaces	within .030"(if measurable)

Note : Measure target centering for Veeco Oval assemblies (9" x 12" and 12" x 14") in center location of ends and sides. Maximun amount of Backing Plate exposure .020".

VISUAL

9.1 Cracks:	No visible cracks
9.2 Pits and/or Pullouts: :	none > 1/16": 1 visible per 4 square inches
9.3 Chips (target edges):	depth: 25% target thickness, none > 1/4" any direction
9.4 Inclusions: none > 1/64"	1 visible per 4 square inches
9.5 Surface Finish:	63 μinch or better (machined surfaces only)
9.6 Striations and Sinter Lines (hot pressed materials):	none > 1/16" wide
9.7 Discolorations:	No discolorations caused by foreign substances
9.8 Appearance:	No fingerprints, oils, or foreign substances

 DEFINITIONS:

 Bond Centering -- A measure of how well a target is centered on a backing plate after bonding. The maximum difference between two measurements on opposite sides of the assembly; the measurement being the distance between the target and the backing plate. For a perfectly centered target, the difference will be zero all around.

Chips/Dents -- Small or large cavities on a part's surface, edge, or corner usually caused by an unrelated object/event - i.e. damage from sharp tools or from dropping.

Cracks -- Abnormal gaps that are usually created during cooling of a cast material.

Discolorations -- Color variations commonly present due to aspects of the manufacturing process.

Inclusions – Foreign materials which are unlike the composition material(s). This is observed as a discontinuity in the material.

Pits and/or Pullouts -- Small or large cavities on a part's surface not caused by an unrelated object/event. Pits are material defects and are usually cone shaped. Pullouts are usually randomly shaped and caused by a cutting tool.

Solder Protrusions -- Bond solder that extends further than the backing plate or the target.

Solder Voids -- Spaces between the backing plate and target due to the absence of solder.

Striations and Sinter Lines -- Abnormal random streaks or lines on the surface of a part.

Surface Finish -- Property of a part's surface that describes its finish traits. Surface can be pressed, hand finished, faced, ground, or to a machined surface finish level.