Homogenous fine grain structure for repeatable deposition throughout target life.
PureCon™ for UHV
PureCon™ materials have been engineered as a UHV materials solution for GMR thin film head production,
as well as MRAM applications. PureCon™ materials have been purified to reduce the
gaseous impurities to extremely low levels. At the same time, further metallic impurity reductions have
also been achieved. These improvements have been implemented without sacrificing consistently fine
grain size. The net result yields sputtering targets that are optimal not only for current thin film deposition
equipment, but also for use in future generation UHV deposition tools.
BENEFITS
- Fine Grain Size
- Low Gaseous Impurities
- Film Uniformity Improvement
- P.T.F. Optimization
MATERIAL DATA
Purity Levels up to 99.999%
|
Grain Size (Microns) |
Non-Metallics |
(C ppm) |
(O ppm) |
(H ppm) |
(N ppm) |
Cu |
<200 |
<10 |
<20 |
<5 |
<20 |
Ta |
<100 |
<20 |
<30 |
<5 |
<10 |
Al |
<200 |
<10 |
<20 |
<5 |
<10 |
Ru |
<50 |
<50 |
<100 |
<5 |
<10 |
Rh |
<50 |
<50 |
<100 |
<5 |
<10 |
Co/Fe |
<50 |
<20 |
<10 |
<5 |
<10 |
Ni/Fe |
<50 |
<20 |
<10 |
<5 |
<10 |
Ni/Fe/Cr |
<50 |
<20 |
<100 |
<5 |
<10 |
Ni/Co/Fe |
<50 |
<20 |
<20 |
<5 |
<10 |
Mn/Pt |
<100 |
<200 |
<300 |
<10 |
<200 |
Mn/Ir |
<100 |
<300 |
<600 |
<10 |
<300 |
|
 |
|
Have a question? |
|
|
|
Developing a material for your application?
Need process information about a product?
Our engineers can help.
|
|
|
|
|
