OEM qualified supplier with global support
Silicon is the second most abundant element in nature, accounting for about 25.7% of the earth's crust. It can be found in Group IVB of the Periodic Table. Williams produces silicon from crystal growing techniques. The primary sputtering techniques for silicon are, RF Sputtering and DC Magnetron.
Benefits
- Optimal Dopant Level Stocking Programs
- Single Crystal Material Global Support
- Low Cost Material OEM Qualified
Backing Plates & Bonding
Williams provides Molybdenum and alternative backing plate material for all major metallizing equipment. Our state-of-the-art bonding centers are located globally, offering standard metallic target bonding and high temperature solder bonding for greater disc metallizing throughput. Void free solder bonding verified by ultrasonic inspection.
Material Properties
| Chemical Properties |
| Atomic Symbol: |
Si |
| Density: |
2.33 g/cm3 |
| Atomic Number: |
14 |
| Atomic Weight: |
28.086 |
| Crystal Structure: |
FCC |
| Electrical/Physical Properties |
| Electrical Resistively: |
0.005-0.020 ohm-cm |
| Thermal Conductivity: |
149 W m-1 K-1 |
| Coefficient of Thermal Expansion: |
14 |
| Atomic Weight: |
2.33 PPM/K |
| Hardness (Knoop): |
1150 Kg/mm2 |
Hazardous Material Identification Guide
Health |
Flammability |
Reactivity |
PPE |
2 |
2 |
1 |
J |
Vapor Pressure
10 -3 Torr |
1 Torr |
760 Torr |
1477 C |
2052 C |
2357 C |
