Silvetech PT^™ 1 Epoxy

Product Data

Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be inappropriate, Silvertech PT-1 ensures a good bond strength and high thermal and electrical conductivity.

Properties

Physical form	silver paste
Volume Resistivity:
Room temperature cured	.003 ohm-cm @ 25°C
Heat cured, ½ hr @ 150°C	.0005 ohm-cm @ 25°C
Tensile shear strength @ 25°C	1200 psi
Shelf life (room temperature)	4-5 months
Pot life (room temperature)	~ 1 hour
Thermal conductivity (approx.)	1.046 x 10-2 w/cm-°C
Operating temperature range	-60°C - 250°C

Silvertech PT-1 is available in 50g, 100g, and 250g kits. * To determine the right kit for your intended use, consult the following chart:

OR refer to the following calculation:
2g blended epoxy*: 1 inch2 bond area.
(*: Refers to total combined weight of Parts A and B.)

How to apply

1. Measure equal quantities of Part A and Part B (by weight or volume) on a clean paper or cardboard surface. Using the enclosed wooden spatulas, mix the two parts together until completely combined. (Equal amounts by volume will also operate properly.) Combined epoxy may be thinned with toluene; however, toluene must be evaporated off before heat curing.
2. Clean both bond sides of target and backing plate completely. Apply mixed epoxy to both pieces.
3. Press the two pieces together. Remove excess epoxy with enclosed swabs. Residual uncured epoxy may be wiped clean with methanol or toluene.
4. Cure for 24 hours @ room temperature, or 3 hours @ 60°C.

CAUTION: Avoid eye and skin contact. Wash off affected area with soap and water. Refer to MSDS for each part before use or disposal.