High purity, low alkali materials ensure excellent film uniformity and reduced particulation.
UNDER
BOND
METALLIZATION
UBM™ grade thin film deposition materials have been engineered to optimize performance in wafer
level packaging processes. Semiconductor companies have adopted flip chip packaging as a low cost,
high volume assembly technology solution. UBM™ grade materials display a uniform, fine grain size
that improves overall thin film uniformity. Gaseous impurities have also been further reduced, resulting
in extremely consistent thin film electrical properties. All of this adds up to enhanced device performance
and greater wafer yield.
BENEFITS
- Fine Grain Size
- Film Uniformity Improvement
- Low Gaseous Impurities
- Consistent Electrical Properties
MATERIAL DATA
Purity Levels up to 99.999%
|
Grain Size (Microns) |
Non-Metallics |
(C ppm) |
(O ppm) |
(H ppm) |
(N ppm) |
Au |
<100 |
<30 |
<20 |
<5 |
<10 |
Cu |
<150 |
<10 |
<20 |
<5 |
<5 |
Al |
<100 |
<10 |
<10 |
<5 |
<5 |
Ti |
<50 |
<100 |
<500 |
<5 |
<50 |
Cr |
<250 |
<50 |
<100 |
<200 |
<50 |
Al/Cu |
<100 |
<10 |
<50 |
<5 |
<5 |
Ni/V |
<100 |
<50 |
<100 |
<50 |
<50 |
Ni/W |
<100 |
<50 |
<100 |
<5 |
<50 |
W/Ti |
<250 |
<100 |
<600 |
<100 |
<50 |
Cr/Cu |
<250 |
<50 |
<1000 |
<10 |
<500 |
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