Specialty bonding materials with highly dissimilar coefficients of thermal expansion.
Utilizing a variety of sputtered and evaporated techniques, Williams Advanced Materials offers target bonding to backing plates, enabling bonded assemblies to withstand a broad range of operating temperatures and parameters.
Through our global manufacturing reach we are able to offer bonding services in Brewster NY, Santa Clara CA, Buffalo NY, Ireland, Singapore, and Taiwan.
Williams specializes in indium solder bonding of materials with highly dissimilar coefficients of thermal expansion.
Williams supports a wide variety of OEM Platforms:
AMAT™, Novellus™, Trikon™, Anelva™, Ulvac™, SFI™, KDF™, NEXX™, CVC™, Unaxis™, Veeco™, Singulus etc.
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