Fine Grain Microstructural Development for Thin Film Deposition ApplicationsAbstract
The development of a fine grain microstructure in sputtering targets for thin film applications is a critical factor in the efficiency and robustness of the deposition process. This research was initiated to produce a practical method of producing superior fine grain sputtering targets.
The SFGTM process has been developed to achieve a consistently superior fine grain in non-ferrous metals. SFGTM targets produced from gold and silver were compared against industry standard targets. A comprehensive examination of the grain structure was performed to distinguish between the two microstructures. The film deposited by these targets was also investigated. The attributes measured include film thickness profile, deposition rate, and film uniformity.
The SFGTM process produced a consistently finer grain size when compared against the industry standard microstructure. The improved microstructure was observed in both gold and silver. The sputtered thin film thickness profile was also improved when using the SFGTM target. In addition, the sputter rate and the absolute difference in the thin film was superior when the SFGTM target was utilized. Similar results occur in other precious metals and non-ferrous alloys.
Using a SFGTM target allows for a uniform erosion pattern to develop during the sputtering process. The randomly orientated grain structure developed eliminates any preferred sputtering of the target material. When preferential sputtering occurs, the target erodes unevenly. This leads to both a poorly sputtered thin film and less than optimal utilization of the target material.
The SFGTM process produces a sputtering target that contributes to a superior thin film for optical and other deposition applications.
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